CyberOptics Semiconductor to Demo Final Production Version of WaferSense(R) Airborne Particle Sensor at Semicon Japan

Top Quote CyberOptics Semiconductors ( will demonstrate the final production version of the WaferSenseŽ Airborne Particle Sensor (APS) during Semicon Japan in booth number 5B-204. End Quote
  • (1888PressRelease) November 28, 2011 - The company will also feature its full line of WaferSense wireless metrology devices at the international trade show scheduled for December 5 - 7, 2011 at the Makuhari Messe in Chiba, Japan.

    Addressing the limitations of traditional airborne particle with limited reach and static output, the WaferSense APS travels through the entire semiconductor process, counting particles to identify when and where particles are occurring in real time. By reducing the time and expense associated with process equipment particle qualification, the APS improves die yield and compress final wafer inspection.

    Fabs unable to isolate and mitigate the source of particles in a tool before wafer processing can use this sensor to efficiently detect and classify particles with their exact sources as wafers are transferred, slit valves actuate and chambers are cycled, pumped down and purged. With real-time views of particle conditions, process engineers can address specific trouble spots and be better prepared to pass particle qualifications on the very first attempt.

    The APS is available in 200 mm, 300 mm (and 450mm special order) wafer-like form factors. For more information on the Airborne Particle Sensor, please refer to our web site at or contact sales at CSsales ( @ ) cyberoptics dot com. You can also visit the company's Japanese language site at

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