TE Connectivity Introduces the Chip Connect Cable Assemblies

Top Quote TE Connectivity Introduces the Chip Connect Cable Assemblies, the Chip Connect internal faceplate-to-processor cable assemblies enable Intel Omni-Path Architecture (OPA) by mating directly with LGA 3647 sockets at the processor and Intel Omni-Path Internal Faceplate Transition (IFT) connectors at the faceplate for 25 Gbps speeds. End Quote
  • (1888PressRelease) August 19, 2017 - Hong Kong, Asia - Chip Connect cable assemblies reduce system design costs by eliminating the need to use costlier lower-loss PCB materials and retimes. With these interconnects, system design is made easier by reducing the complexity of PCB laminates and routing. These products are available in standard lengths and breakout configurations, but can be customized for specific applications. Take advantage of our broad range of high speed solutions such as Sliver connectors and STRADA Whisper connectors to create custom connections on the board or faceplate.

    As authorized distributor for TE Connectivity, Heilind Asia provides TE products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry's leading manufacturers in 25 component categories, with a particular focus on interconnect and electromechanical products.

    About Heilind Electronics:
    Founded in 1974, Heilind Electronics, Inc. (www.heilind.com) is one of the world's leading distributors of connectors, relays, switches, thermal management & circuit protection products, terminal blocks, wire & cable, wiring accessories and insulation & identification products. Heilind has over 40 facilities in the United States, Canada, Mexico, Brazil, Germany, Hong Kong, Singapore and China.

    Heilind Asia Pacific (www.heilindasia.com) commenced operations in Dec 2012, and now has 19 locations throughout Asia. Its industry leading service offering to customers in Asia Pacific is the result of a commitment to the belief of "Distribution As It Should Be".

    About TE Connectivity
    TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our commitment to innovation enables advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. TE's unmatched breadth of connectivity and sensor solutions, proven in the harshest of environments, helps build a safer, greener, smarter and more connected world. With 75,000 people including more than 7,000 engineers working alongside customers in nearly 150 countries, we help ensure that EVERY CONNECTION COUNTS www.te.com.

    Chip Connect, TE Connectivity, TE and EVERY CONNECTION COUNTS are trademarks.

    Press Contact:
    sarah luo
    Heilind Asia Pacific
    RM 1707-10,DELTA HOUSE,3 ON YIU ST

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