(1888PressRelease)
November 25, 2008 - Seaford, DE – Skyray XRF has released the newest addition to its low-cost x-ray fluorescence instrument line; the Thick-800. Developed specifically for measuring plating thickness, the Thick-800 XRF can provide measurements of single-layer, multi-layer, thin-film coatings and solders with composition.
The Thick-800 XRF Instrument from Skyray XRF is the first unit in the product line-up to feature a top-down measurement system. This style allows for a sample stage with three-dimensional movement; with the press of a button the sample can move from point to point on a sample or up and down if needed. The top-down measurement system also allowed Skyray XRF to offer a three-sided chamber door so that users can measure smaller samples with the door closed (chamber size of 20”x14”x5”) or open the door to create a ‘slotted chamber’ and fit larger samples or printed circuit boards.
This system utilizes an electro-cooled Silicon-PIN semiconductor detection system, which offers a resolution of 149-160eV and does not require Liquid Nitrogen (LN2). To insure sample alignment accuracy, the Thick-800 was developed with a color-camera sample viewing system and double laser position technology. Many organizations that utilize XRF for coating thickness measurements look to reconditioned instruments to limit costs, but the low-cost Thick-800 allows a company with any sized budget to utilize the newest, most reliable technology.
“Our focus to this point has been offering low-cost, high-performing units for precious metal analysis and hazardous substance detection,” stated Scott Kramer, Director of Sales and Marketing for Skyray XRF. “The Thick-800, in addition to the EDX-600, allows us to offer low cost testing solutions for another common application.”
Skyray XRF is the North American representative of an international leader in x-ray fluorescence technology. Overviews of the full product line, applications and XRF technology can be found at www.skyrayxrf.com.
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