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Hesse-knipps.com - Hesse & Knipps Company News Section

Hesse & Knipps Information

Joseph Bubel

9305 Paragon Drive
Phone: 408-436-9300
URL: http://www.hesse-knipps.com

Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle aluminum and gold wire in round and ribbon wire configurations with solutions for both light and heavy wire applications ranging from 12.5 micron (.0005) to 500 microns (.020) wire diameters. The company’s product line also includes dispensers and ultrasonic flip chip bonders, standard or customized indexers and handling systems, and process and manufacturing monitoring systems for interfacing with the company’s equipment and commercial software packages.

Hesse & Knipps Press Release -

Hesse-knipps.com

06
JAN

Hesse & Knipps Partners With Michael Whitehead To Support Legacy Wire Bonding Equipment

Hesse & Knipps, leading manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, will partner with MEW Consulting, recently founded by Michael Whitehead, to provide technical support for third-party wedge and wire bonding equipment being phased out by the original manufacturers.

Through the partnership, Hesse & Knipps and MEW Consulting will provide various support services including:

• High level technical and ...

26
JUL

Hesse & Knipps To Introduce Wire Bonder For Solar Market

Hesse & Knipps, leading manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, announces that it will soon introduce a new wire bonder dedicated to the needs of the solar market in producing CPV (concentrated photovoltaic) cells.

The new BondJet 820 CPV will offer all of the advanced features of the company’s Bondjet BJ 820 wedge bonder, in addition to an extended table travel ...

26 JUN	Hesse & Knipps Presents Most Flexible And Fastest Wedge Bonder For Both Ribbon And Wire Bonding
	Hesse & Knipps, leading manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, is demonstrating the capabilities of the BONDJET BJ820 during Semicon West in booth 7357. The BONDJET BJ820 is a high-speed, fully automatic wedge bonder that offers the ultimate in flexibility for both high-speed round wire and deep access ...