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| Hesse & Knipps Information |
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| Joseph Bubel |
9305 Paragon Drive
Phone: 408-436-9300
URL: http://www.hesse-knipps.com
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| Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle aluminum and gold wire in round and ribbon wire configurations with solutions for both light and heavy wire applications ranging from 12.5 micron (.0005) to 500 microns (.020) wire diameters. The company’s product line also includes dispensers and ultrasonic flip chip bonders, standard or customized indexers and handling systems, and process and manufacturing monitoring systems for interfacing with the company’s equipment and commercial software packages. |
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