Global 3D IC and TSV Interconnect Market (2011-2016)
The advances in semiconductor technology brought in the demand for faster and energy efficient interconnects in the ICs to be used in semiconductor devices.
- Dallas, TX (1888PressRelease) November 16, 2011 - Global 3D IC and TSV Interconnect Market (2011-2016)
KEY TAKE AWAYS
To define and classify the global 3D IC Market with in-detail segmentation.
To measure the global 3D IC Market and its various sub-segments, technologies, fabrication methods and applications.
To get a clear picture of the future of the 3D IC technology from both, in a technical and market-oriented perspective.
To identify the major driving factors and inhibitors for the global 3D IC market.
To analyze the trends and forecasts of the 3D IC market and its individual segments.
To measure the global consumption of 3D ICs market in several end user verticals.
To identify the major stakeholders in the market and draw a competitive landscape for the market leaders.
To analyze the trends and forecasts of the 3D IC market specific to various geographical regions across the globe.
Browse All : 3D IC Market
Browse All : TSV Interconnect Market
The advances in semiconductor technology brought in the demand for faster and energy efficient interconnects in the ICs to be used in semiconductor devices. Usually, for ICs, interconnects face the challenge to meet up the demands for speed for data transfer. In addition, a marginal increase in speed is coupled with a significant increase in the energy requirements. To meet the extended demands, 3D ICs was proposed as a solution. Several companies in the IC interconnect market are entering the race to conduct extensive research in 3D IC technology, to improve the performance and reliability. Though the researches are trying to deal with several challenges in-front of this new technology, the promising features of 3D ICs are bound to make 3D IC technology, a mainstream technology in the next five to ten years. Though their application in 2009 is limited to only some memory chips and semiconductor technologies, but the companies have plans to implement this technology to more complex products, for example by 2014, the 3D ICs are planned to be integrated in vertical devices on CMOS technology. Also considering the huge investments being made, the market will surely hold tremendous potential for the early movers but huge investment for R&D is a compulsion to succeed in this market.
Global 3D IC Market and TSV Interconnect Market (2011 - 2016) research report analyzes in detail the important types of 3D IC structures. We have also included in-depth research on the 3D IC technologies and 3D IC fabrication technologies like Beam Re-crystallization, Process Wafer Bonding, Silicon Epitaxial growth and Solid Phase Crystallization. This report also discusses the reliability issues of 3D ICs like thermal stability, EMI issues, etc and the advantages that 3D ICs induces in interconnect design and performance. The applications of 3D ICs like CMOS Image sensors, 3D stacked memory, and multi-core processors with cache memory, Multi-level 3D IC and Vertical device on CMOS have been included and analyzed in this report. We have done an in-depth geographic analysis for each of the markets and their sub-segments, covering the major regional markets.
Releated Report : Semiconductor and Electronics Market
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